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Replacement for Polymer Masking Material

29 Submissions
$15,000 USD
Challenge closed

Challenge overview

The Seeker uses a vacuum sputtering technology to place dielectric materials onto non-metallic substrates. Placement is critical so the non-metallic parts need to be fixed in place and masked by a thermoformed material during the process. Thermoformic materials have been found, but they give off volatiles that degrade the coating under process conditions. A new material and process are required to affix and mask the components effectively. 

This Challenge requires only a written proposal.

The Seeker is a producer of high-tech non-metallic components. Increased demand has led them to use new technologies and techniques to produce the components. Vacuum deposition sputtering processes are used to deposit conductive and dielectric coatings on one side of non-metallic components. The other side needs to be protected (masked) and fixed in place during the process. Thermoformic polymer films will work, but so far, give off too many volatiles which affect the deposited coatings. An alternative material and method are required to improve the process. 

This is a Theoretical Challenge that requires only a written proposal to be submitted. The Challenge award will be contingent upon theoretical evaluation of the proposal by the Seeker. 

To receive an award, the Solvers will have to transfer to the Seeker their exclusive Intellectual Property (IP) rights to the solution for the Seeker’s field of business.

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